【Introduction】

        When the metal is at the nanometer scale, it exhibits strong volume effect, quantum size effect, surface effect and quantum tunneling effect. The atoms of the nano-silver particles in contact with each other diffuse each other to form interconnected joints. This process is called sintering. When a large number of nano-silver particles are stacked on each other, the phenomenon of connecting to form a bulk metal sintered body at a temperature lower than the melting point of the bulk metal can be realized, and the purpose of low-temperature interconnection and high-temperature use can be achieved.

【Innovation Results】

         The nano silver paste sintering interconnection technology of the third-generation semiconductor heat dissipation package structure is realized, and the mechanism of the formation of a large number of twin structures in the nano silver sintered body is studied, and the thermal conductivity reaches 278W/mK. The research results were published on ACS Appl. Mater. Interf. and Scripta Mater., and won 1 national invention patent.

【Scope of application】

        It has broad application prospects in the next generation of semiconductor power packaging applications.

【Person in charge of results】

       Li Mingyu