【Introduction】

       Using the heat energy released at the interconnection interface when the solder bumps and the substrate metal are ultrasonically rubbed, the local heating and melting of the solder bumps are realized, and then the metallurgical reaction between the melting solder and the metal pad can realize the inversion of the device and the substrate. Install interconnection. Because the interconnection process takes place at room temperature, and the thermal effect of ultrasonic friction has been proven to be limited to the interconnection interface, it avoids the disadvantage that temperature-sensitive devices may fail due to high temperatures in traditional reflow packaging. It has the advantage in the microelectronic packaging industry Wide application prospects.

【Innovation Results】

        A new method of soldering with local heating at the interconnection interface induced by ultrasound at room temperature is proposed, and the law of sonochemical effect to promote the formation of all-metallic compound structure inside the solder containing iodine is explained. The research content won the first prize of China Machinery Industry Science and Technology, and the results were published on Ultrasonic & Sonochemestry and APL, and won 1 national invention patent

【Scope of application】

        It has broad application prospects in the electronics manufacturing industry.

【Person in charge of results】

        Li Mingyu